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CVE-2023-33114 | Qualcomm 315 5G IoT Modem NPU memory corruption
A vulnerability was found in Qualcomm 315 5G IoT Modem, 460 Mobile Platform, 660 Mobile Platform, 662 Mobile Platform, 665 Mobile Platform, 675 Mobile Platform, 678 Mobile Platform SM6150-AC, 680 4G Mobile Platform, 685 4G Mobile Platform SM6225-AD, 690 5G Mobile Platform, 720G Mobile Platform, 730 Mobile Platform SM7150-AA, 730G Mobile Platform SM7150-AB, 732G Mobile Platform SM7150-AC, 750G 5G Mobile Platform, 765 5G Mobile Platform SM7250-AA, 765G 5G Mobile Platform SM7250-AB, 768G 5G Mobile Platform SM7250-AC, 855 Mobile Platform, 855+, 860 Mobile Platform SM8150-AC, 865 5G Mobile Platform, 865+ 5G Mobile Platform SM8250-AB, 870 5G Mobile Platform SM8250-AC, AQT1000, AR8031, AR8035, Auto 5G Modem-RF, C-V2X 9150, CSRA6620, CSRA6640, FastConnect 6200, FastConnect 6700, FastConnect 6800, FastConnect 6900, Flight RB5 5G Platform, QAM8295P, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA8337, QCM6125, QCN9011, QCN9012, QCS410, QCS610, QCS6125, QCS6490, QCS8250, QRB5165M, QRB5165N, Qualcomm Video Collaboration VC1 Platform, Qualcomm Video Collaboration VC3 Platform, Qualcomm Video Collaboration VC5 Platform, Robotics RB5 Platform, SA4150P, SA4155P, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SA8295P, SD660, SD730, SD855, SD865 5G, SDX55, SM4125, SM6250, SM7250P, Smart Audio 400 Platform, SW5100, SW5100P, SXR2130, W5+ Gen 1 Wearable Platform, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3610, WCN3660B, WCN3680B and WCN3910 and classified as critical. Affected by this issue is some unknown functionality of the component NPU Handler. The manipulation leads to memory corruption. This vulnerability is handled as CVE-2023-33114. An attack has to be approached locally. There is no exploit available. It is recommended to upgrade the affected component.